BCC Fuba India Limited

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Multilayer PCBs

Multilayer PCBs are a type of printed circuit board that consists of more than two conductive copper layers (commonly four or more) separated by insulating layers, known as substrates or prepreg. These boards allow for more complex and denser circuitry compared to single or double-layer PCBs.

Here are some key aspects of multilayer PCBs:

  • Enhanced Complexity: Multilayer PCBs provide more space for routing traces and placing components. This allows for the creation of intricate and compact designs, which is especially beneficial for high-density electronic devices like smartphones, computers, and advanced control systems.
  • Signal Integrity: With multiple layers, signal traces can be designed to minimize interference and signal degradation. This improves the signal integrity and reliability of the circuit, crucial for high-frequency applications and data transmission.
  • Reduced Size and Weight: By distributing the circuit across multiple layers, multilayer PCBs can achieve the same functionality as larger single or double-layer boards, enabling smaller and lighter devices.
  • Power Distribution: Multilayer PCBs allow for efficient power distribution planes, which helps manage power requirements throughout the circuit. This is particularly important in devices with different voltage and current needs.
  • Complex Designs and Technologies: They facilitate the integration of advanced technologies like ball grid arrays (BGAs), which require more layers for connecting the numerous pins beneath the surface of the component.
  • Manufacturing Challenges: While providing significant benefits, multilayer PCBs also pose manufacturing challenges due to their complexity. Precision in layer alignment, drilling, and lamination processes is crucial to ensure proper functionality.
  • Cost Consideration: Multilayer PCBs tend to be more expensive to manufacture compared to single or double-layer boards due to the complexity involved in production and the materials used.

In summary, multilayer PCBs offer increased design flexibility, improved performance, and higher integration capabilities, making them essential for many advanced electronic devices where space, performance, and complexity are critical factors.

BCC Fuba has been manufacturing and exporting multilayer PCBs since its inception and has the capability to manufacture PCBs up to 10 layers.

Our Multilayer PCBs

Technical Specifications Standard Non-standard
Materials used FR-4, FR4 (TG 180) Ceramin, PTFE
Input Media Gerber Data 274X, Gerber Data D, PCB File, DRL File Gerber Data 274X, Gerber Data D, PCB File, DRL File
Approvals IATF 16949:2016, UL94 - V0, ISO 9001:2015 IATF 16949:2016, UL94 - V0, ISO 9001:2015
Copper Thickness 12 μ to 140 μ Above 140 μ
Board Thickness 0.30 mm to 3.20 mm 3.2 mm to 4.5 mm
Minimum Hole Size (Finished) 0.25 mm 0.20 mm
Minimum Line Spacing 0.15 mm 0.125 mm
Minimum Line Width 0.15 mm 0.125 mm
Minimum Annular Ring 0.10 mm 0.075 mm
Maximum Panel Size 535 X 406 560 X 450
Minimum Solder Mask Dam 0.15 mm 0.10 mm
Hole Diameter Tolerence PTH +/-0.075 mm +/-0.05 mm
Hole Diameter Tolerence NPTH +/-0.05 mm +/-0.05 mm
Profile Routing Tolerence +/-0.20 mm ,+/-0.10
Aspect ratio 5.3:1 6.4:1
Surface Finish Lead Free HASL, Tin-lead HASL, and Lacquer ENIG
Solder Mask Colors Green, Black, White, Red, Yellow, Grey and Blue All other colours
Peelable mask Top, bottom or both sides Top, bottom or both sides
Electrical test 100% (Flying probe or fixture test) 100% (Flying probe or fixture test)
Quality Standards IPC-A-600 J / PERFAG IPC-A-600 J / PERFAG